| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a crystal vibration chip, which can advance wet etching without being affected by a crystal plane 5 of crystal having anisotropy, and to provide a method for manufacturing a crystal device. <P>SOLUTION: Since wet etching is advanced from an exposed surface 7 of a vibration arm part 2 and the wet etching is further advanced from a modified layer 6 formed on the crystal plane 5 (5A, 5B), a problem that the wet etching is not advanced on the crystal plane 5 (5A, 5B) can be solved. <P>COPYRIGHT: (C)2011,JPO&INPIT |
