| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance reliability of a semiconductor device and a yield of manufacture thereof. <P>SOLUTION: A method of manufacturing the semiconductor device includes stacking a lead frame LF1, a semiconductor chip CPH, a lead frame LF2, and a semiconductor chip CPL on an assembly implement in order with solder interposed between them, carrying out solder reflow processing to fabricate an assembly thereof, and then sandwiching the assembly between molding dies MD1 and MD2 to form an encapsulation resin portion MR. Steps are provided on an upper surface of the die MD2. In a molding step, the lead frame LF2 is clamped with the dies MD1 and MD2 at a position higher than the lead frame LF1, and a lead frame LF3 is clamped with the dies MD1 and MD2 at a higher position. The assembly implement is provided with steps of the same height at positions corresponding to the steps on the upper surface of the die MD2. <P>COPYRIGHT: (C)2011,JPO&INPIT |
