CERAMIC PACKAGE, METHOD FOR REDUCING JOINT NOISE IN CERAMIC PACKAGE AND CONTROLLING IMPEDANCE DISCONTINUITY, AND COMPUTER PROGRAM (NOISE JOINT REDUCTION AND IMPEDANCE DISCONTINUITY CONTROL IN HIGH-SPEED CERAMIC MODULE)

摘要

PROBLEM TO BE SOLVED: To provide an improved multi-layer ceramic package. SOLUTION: The multi-layer ceramic package comprises a plurality of signal layers in which each of signal layers has one or a plurality of signal lines; a plurality of vias in which each of vias provides one of voltage (Vdd) power connection and ground connection (Gnd); at least one reference mesh layer abutting on one or a plurality of signal layers; and a plurality of via connecting coplanar type shield (VCS) lines having a first VCS line extending at a first side of a first signal line and a second VCS line extending at a second side facing the first side of the first signal line in a plurality of signal layers. Each of a plurality of VCS lines is connected to one or a plurality of vias arranged along a directional channel where the VCS line extends, and extends beyond the vias. Joint noise in the ceramic package can be reduced and impedance discontinuity can be controlled by an arrangement of VCS lines in relation to signal lines. COPYRIGHT: (C)2011,JPO&INPIT