| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform laser beam machining to the whole of a workpiece while suppressing the enlargement of a laser beam machining device even in the case abnormality is caused in any laser oscillation source among a plurality of laser oscillation sources, and the oscillation of a laser beam can not be performed. <P>SOLUTION: A laser beam emitting means 60 provided at the laser beam machining device 1 includes: two first and second laser beam oscillating sources 61a, 61b; first and second laser beam branching means 63a, 63b branching the laser beams oscillated from the first and second laser beam oscillating sources 61a, 61b, e.g., into three optical paths; and, e.g., three first and second oscillators 62a, 62b condensing each laser beam branched to the three optical paths by the first and second laser beam branching means 63a, 63b toward a glass substrate W.Then, the first condenser 62a and the second condenser 62b are arranged in one line alternately along an indexing feed direction. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
