| 摘要 |
PROBLEM TO BE SOLVED: To provide a heater with high rigidity at relatively low cost, which improves the characteristics of temperature increase and decrease and realizes a high throughput through. SOLUTION: The heater includes a first heat equalizing plate having a wafer placing surface, a second heat equalizing plate supporting the first heat equalizing plate, and a resistive heating element between the first heat equalizing plate and the second heat equalizing plate, and is structured by integrating the resistive heating element with an opposite face from the wafer placing surface of the first heat equalizing plate by an insulation adhesive layer. By having such a structure, the heater capable of raising or lowering temperature at high speed without generation of deformation or cracks can be provided. COPYRIGHT: (C)2011,JPO&INPIT |
