| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem, wherein recently in the tendency of enlargement in the diameter of a wafer causes the difficulties in uniform heating over the entire surface of the wafers to be superimposed. SOLUTION: A heating module for heating a wafer includes a stage portion having a placing surface for placing a work to be heated, and a plurality of heater plates disposed on a surface to be heated which is opposite to the placing surface of the stage portion. The plurality of heater plates are disposed so as to cover at least a region, corresponding to the placing surface and be separated so that adjacent sides are parallel to each other. COPYRIGHT: (C)2011,JPO&INPIT |
