Disclosed are compounds for plasma ashing photoresist layers on a substrate and methods of using the same. The plasma ashing compounds induce limited to no damage to the underlying layer, such as the low-k film layer.
申请公布号
WO2011047179(A2)
申请公布日期
2011.04.21
申请号
WO2010US52711
申请日期
2010.10.14
申请人
L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE;DUSSARRAT, CHRISTIAN;GUPTA, RAHUL;OMARJEE, VINCENT M.;STAFFORD, NATHAN
发明人
DUSSARRAT, CHRISTIAN;GUPTA, RAHUL;OMARJEE, VINCENT M.;STAFFORD, NATHAN
