摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition and a resin composition for seal-filling semiconductor excellent in toughness and heat resistance, and a semiconductor device manufactured using the same. SOLUTION: The epoxy resin composition includes (a) an epoxy resin, (b) a curing agent, (c) a flexible epoxy resin, and (d) a compound having an acryl group or a methacryl group. COPYRIGHT: (C)2011,JPO&INPIT |