发明名称 METHOD OF MANUFACTURING CONNECTION STRUCTURE, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure, the method improving conductive reliability. SOLUTION: The method of manufacturing the connection structure 1 includes: a step in which, in a region in which an electrode 2b of the upper face 2a of a first connection object member 2 is installed, a first paste containing conductive particles 5 is coated and a first paste layer 11 is formed; a step in which, in the region in which the electrode 2b of the upper face 2a of the first connection object member 2 is not installed, a second paste containing no conductive particles is coated and a second past layer 12 is formed; and a step in which, so that the electrodes 2b, 4b may oppose to the upper faces 11a, 12a of the first and second past layers 11, 12, the second connection object member 4 is laminated and the first and second paste layers 11, 12 are cured. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011082023(A) 申请公布日期 2011.04.21
申请号 JP20090233447 申请日期 2009.10.07
申请人 SEKISUI CHEM CO LTD 发明人 WADA TAKUYA
分类号 H01R43/00;H01L21/60;H01R11/01 主分类号 H01R43/00
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