| 摘要 |
Disclosed is a method of manufacturing a printed circuit board, including (A) forming a first circuit layer on a base substrate and forming a first insulating layer thereon, (B) forming trenches including dummy trenches and wiring trenches on the first insulating layer and plating the trenches, thus providing a trench circuit layer including a dummy circuit pattern and a wiring circuit pattern, (C) removing the dummy circuit pattern of the trench circuit layer, and (D) forming a second insulating layer on the trench circuit layer from which the dummy circuit pattern was removed. The method reduces deviation of plating thickness and thus realizes the design density of a trench circuit layer.
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