| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board, along with a method of manufacturing the board, in which a manufacturing process can be simplified and a fine circuit pattern can be achieved as a circuit pattern can be formed simultaneously on both surfaces of a base substrate by forming a trench on both surfaces of the base substrate. SOLUTION: The printed circuit board includes a base substrate 100, an insulating layer 110 laminated on both surfaces of the base substrate 100 where a trench 120 is formed, and a circuit layer 140 including a circuit pattern 123 and a via 125 which are formed inside the trench 120 by a plating process. COPYRIGHT: (C)2011,JPO&INPIT
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