| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an LED substrate which has no insulating adhesive between an Al board and an LED and can be soldered to a heat dissipating module. <P>SOLUTION: The method of manufacturing the LED substrate includes providing a conductive metal board, forming a plurality of grooves on the top face of the conductive metal board, protecting the conductive metal board from corrosion, forming a substrate having a circuit and wiring for plating the conductive metal board and subjected to etching, carrying out electroless plating on the etched substrate to form a substrate subjected to electroless plating, carrying out metal plating on the electroless plated substrate, and coating the metal plated substrate with a mask to obtain the LED substrate. An LED chip is mounted on the surface of a metal layer without accompanying an insulating adhesive underlayer, so that heat from the LED chip can be scattered efficiently. The LED substrate can be soldered directly to a heat dissipating module to further improve efficiency of heat dissipation. <P>COPYRIGHT: (C)2011,JPO&INPIT |
