| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition which is sufficiently excellent in embedding property when being formed into a film shape and which enables manufacturing of a semiconductor and is excellent in bonding reliability, and to provide an adhesive sheet and a method of manufacturing a semiconductor device using the same. <P>SOLUTION: The adhesive composition includes (A) a thermoplastic resin, (B) a heat-curable resin, (C) a latent curing agent, (D) an inorganic filler, and (E) organic microparticles. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
