发明名称 Method for Manufacturing a Low Defect Interface Between a Dielectric and a III-V Compound
摘要 The present invention is related to a method for manufacturing a low defect interface between a dielectric material and an III-V compound. More specifically, the present invention relates to a method for manufacturing a passivated interface between a dielectric material and an III-V compound. The present invention is also directed to a device comprising a low defect interface between a dielectric material and an III-V compound that has improved performance.
申请公布号 US2011089469(A1) 申请公布日期 2011.04.21
申请号 US20100896541 申请日期 2010.10.01
申请人 IMEC 发明人 MERCKLING CLEMENT
分类号 H01L29/205;H01L21/20 主分类号 H01L29/205
代理机构 代理人
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