发明名称 |
PRESSURE-SENSITIVE ADHESIVE FILM AND BACK-GRINDING METHOD USING THE SAME |
摘要 |
The present invention relates to a pressure-sensitive adhesive film and a semiconductor wafer backgrinding method using the same. The present invention provides a pressure-sensitive adhesive film capable of remarkably improving production efficiency in a wafer backgrinding of a semiconductor manufacturing process due to its superior cutting and adherence properties in the semiconductor manufacturing process and an excellent cushioning property. Moreover, the present invention also provides a pressure-sensitive adhesive film having superior peeling and re-peeling properties and wettability to the wafer while providing excellent water resistance, and a backgrinding method using the pressure-sensitive adhesive film.
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申请公布号 |
US2011091676(A1) |
申请公布日期 |
2011.04.21 |
申请号 |
US20090988774 |
申请日期 |
2009.04.21 |
申请人 |
LG CHEM, LTD |
发明人 |
KIM SE RA;BAEK YOON JEON;KIM JAN SOON;SON HYUN HEE;HONG JONG WAN;PARK HYUN WOO |
分类号 |
C09J7/02;B24B1/00;B32B5/00;B32B33/00;C09J133/08;C09J133/10 |
主分类号 |
C09J7/02 |
代理机构 |
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主权项 |
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