<p>PURPOSE: An optical device and a method of fabricating the same are provided to make the thickness of each solder films thin by forming a solder film on a planar light circuit platform and a light active chip. CONSTITUTION: In an optical device and a method of fabricating the same, a substrate(110) comprises a waveguide region and a mounting region. The optical waveguide is composed of a lower-clad layer(112), an upper clad layer(116), and platform core. A terrace(118) comprises an interlocking part. A light active chip(130) is mounted in the mounting region of the substrate. A chip alignment mark(136) is mounted in the mounting surface of the light active chip.</p>
申请公布号
KR20110040058(A)
申请公布日期
2011.04.20
申请号
KR20090097184
申请日期
2009.10.13
申请人
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人
HAN, YOUNG TAK;PARK, SANG HO;LEE, DONG HUN;SHIN, JANG UK;HAN, SANG PIL;BAEK, YONG SOON