| 发明名称 |
Contact structure for a semiconductor material and a method for providing such structure |
| 摘要 |
<p>The present invention is related a contact structure comprising:
a substrate (1) of semiconductor material having an interface on one of its surfaces, and
an electrical contact at the interface of said substrate of semiconductor material comprising a granular metal layer.</p> |
| 申请公布号 |
EP1626449(B1) |
申请公布日期 |
2011.04.20 |
| 申请号 |
EP20050447181 |
申请日期 |
2005.08.12 |
| 申请人 |
IMEC |
发明人 |
ARKHIPOV, VLADIMIR;HEREMANS, PAUL |
| 分类号 |
H01L51/52;H01L51/10;H01L51/44 |
主分类号 |
H01L51/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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