| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device, capable of easily and accurately removing burrs formed when resin sealing, in a short time. <P>SOLUTION: The manufacturing method for the semiconductor device has a resin-sealing process S5 for selecting a used molding die from a plurality of the molding dies, and sealing a die pad and a semiconductor element; and a marking process S6 for marking a discriminating symbol, capable of discriminating the molding die on a lead frame. The manufacturing method, further, has a discriminating process S7 for reading the discriminating symbol, and discriminating the used molding die, while reading the positional information of a corresponding burrs from a recording medium recording the positional information at each molding die; and a deburring process S8 for irradiating a specified place with a laser, and removing the burr formed on the lead frame, on the basis of the positional information of the burr. <P>COPYRIGHT: (C)2007,JPO&INPIT |
