| 摘要 |
In a printed circuit, a conductive pattern is formed on an insulating substrate, of e.g. glass or ceramic, by a method comprising the following steps:- (a) a film of PbS is applied to a surface of the substrate; (b) a negative pattern is formed on the PbS film in developed photo-resist; (c) exposed PbS is etched away; (d) the developed resist is removed, leaving the negative pattern delineated in PbS; (e) a layer of conductive material is deposited over the surface including the PbS negative pattern; (f) the PbS negative pattern is etched away, thus removing the conductive material deposited thereon, and leaving the desired pattern delineated in conductive material on the substrate. The invention is described with reference to the production of a resistive track of Ni-Cr alloy which is deposited by evaporation in a vacuum. Alternatively, a mixture of CrO and SiO may be similarly deposited; or Ta or a Ta compound such as tantalum nitride may be deposited by cathodic sputtering. |
