| 摘要 |
PURPOSE: A semiconductor package is provided to increase productivity by mutually physically and electrically stacking units through a conductive film. CONSTITUTION: In a semiconductor package, a semiconductor chip(150) is attached on a substrate(101) including a window(180). The substrate comprises a top side(110a) and a bottom side(110b) which are opposite to each other. . A semiconductor chip(150) is attached on the top of a substrate body(110). A connecting member(116) electrically connects the bonding finger of the substrate and the bonding finger of a semiconductor chips. A molding member(160) seals up the window of the substrate including the connecting member.
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