PURPOSE: A bonding apparatus using an ACP(Anisotropic Conductive Paste) is provided to reduce the costs for maintaining and repairing a supplementary device and save the fabrication costs thereof. CONSTITUTION: A bonding apparatus using an ACP(Anisotropic Conductive Paste) comprises: an ACP storage box(40) which performs 3 axis exercise while storing an ACP; and a supply unit which supplies the ACP of the ACP storage box to an ACP supply roller(56) and an ACP mixing roller(58), wherein the ACP storage box is installed by including an X-Y stage(34) and a Z-axis transfer unit(36).
