发明名称 METHOD OF PROVIDING CONDUCTIVE STRUCTURES IN A MULTI-FOIL SYSTEM AND MULTIFOIL SYSTEM COMPRISING SAME
摘要 <p>According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils. One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.</p>
申请公布号 EP2311302(A1) 申请公布日期 2011.04.20
申请号 EP20090773785 申请日期 2009.07.01
申请人 NEDERLANDSE ORGANISATIE VOOR TOEGEPAST -NATUURWETENSCHAPPELIJK ONDERZOEK TNO 发明人 DIETZEL, ANDREAS HEINRICH;VAN DEN BRAND, JEROEN
分类号 H05K3/36;H05K3/00;H05K3/32;H05K3/40;H05K3/46 主分类号 H05K3/36
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