发明名称 |
METHOD OF PROVIDING CONDUCTIVE STRUCTURES IN A MULTI-FOIL SYSTEM AND MULTIFOIL SYSTEM COMPRISING SAME |
摘要 |
<p>According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils. One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.</p> |
申请公布号 |
EP2311302(A1) |
申请公布日期 |
2011.04.20 |
申请号 |
EP20090773785 |
申请日期 |
2009.07.01 |
申请人 |
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST -NATUURWETENSCHAPPELIJK ONDERZOEK TNO |
发明人 |
DIETZEL, ANDREAS HEINRICH;VAN DEN BRAND, JEROEN |
分类号 |
H05K3/36;H05K3/00;H05K3/32;H05K3/40;H05K3/46 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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