发明名称 |
Apparatus and methods for packaging electronic devices for optical testing |
摘要 |
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
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申请公布号 |
US7927898(B2) |
申请公布日期 |
2011.04.19 |
申请号 |
US20090534556 |
申请日期 |
2009.08.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
TOSI ALBERTO;STELLARI FRANCO;SONG PEILIN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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