| 摘要 |
The invention is based on the discovery that certain polyether oligomers bearing curable moieties are useful as adhesives for the microelectonic packaging industry. Specifically, certain thermoset adhesive compositions containing polyether oligomers of the invention have good adhesion with lower viscosity, lower resistivity, higher conductivity and higher thixotropy when compared to acrylate- and maleimide-based thermoset adhesives.
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