发明名称 Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same
摘要 A clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the metallic layer, wherein the copper layer has a {100}<001> cube texture in which a deviating angle &Dgr;&phgr; of crystal axes satisfies &Dgr;&phgr;≦̸6 degree. The clad textured metal substrate has an intermediate layer on the surface of the copper layer to form the epitaxial thin film thereon. The intermediate layer preferably includes at least one layer of a material selected from the group consisting of nickel, nickel oxide, zirconium oxide, rare-earth oxide, magnesium oxide, strontium titanate (STO), strontium barium titanate (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium and platinum.
申请公布号 US7927715(B2) 申请公布日期 2011.04.19
申请号 US20080101348 申请日期 2008.04.11
申请人 CHUBU ELECTRIC POWER CO., INC.;TANAKA KIKINZOKU KOGYO K.K. 发明人 KASHIMA NAOJI;NAGAYA SHIGEO;SHIMA KUNIHIRO;HOSHINO HIROFUMI
分类号 B32B15/04;B32B15/18;B32B15/20;B32B18/00 主分类号 B32B15/04
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