| 摘要 |
<p>A mold 11 is fabricated with a cavity 15 formed in an insulating layer 14 formed so as to be placed on an upper surface of a conductive base material 13. This mold 11 is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity 15 to electroform a metal-formed product 12 in the cavity 15. In this electrodepositing process, when the width of the cavity 15 is taken as W and a vertical height of a head space between an upper opening of the cavity 15 and an upper surface of a metal layer 18 is taken as H, the growth of the metal layer 18 is stopped so that the height H of the head space left above the metal layer 18 satisfies:
H ‰¥ W/2.85 where 300 µm ‰¤ W;
H ‰¥ W/3.75 where 200 µm ‰¤ W < 300 µm;
H ‰¥ W/4 where 100 µm ‰¤ W < 200 µm; and
H ‰¥ W/10 where W < 100 µm.</p> |
