发明名称 |
MAINBOARD ASSEMBLY INCLUDING A PACKAGE OVERLYING A DIE DIRECTLY ATTACHED TO THE MAINBOARD |
摘要 |
Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed. |
申请公布号 |
KR20110039396(A) |
申请公布日期 |
2011.04.15 |
申请号 |
KR20117005490 |
申请日期 |
2009.08.27 |
申请人 |
INTEL CORP. |
发明人 |
SEARLS DAMION;ROTH WESTON C.;RAMIREZ MARGARET D.;JACKSON JAMES D.;THOMAS RAINER E.;GEALER CHARLES E. |
分类号 |
H01L23/48;H01L23/12 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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