METHOD FOR PREPARING A HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS

摘要

PURPOSE: A method for preparing adhesive varnish having high thermal conductivity and low dissipation factor in order to build-up additional insulation layers is provided to reduce the material loss by simplifying the process efficiently. CONSTITUTION: At least two epoxy resins are selected(a). The epoxy resins selected to form the epoxy resin precursor are dipped into the pretreated container in particular ratio and heated(b). The solvent is added to the epoxy resin raw material in order to adjust the viscosity of the epoxy resin raw material(c). The bi-hardener solution, the catalyst, and the solvent, and the flow modifier are added to the epoxy resin raw material(d).