PURPOSE: A lens mounting type light emitting diode package is provided to prevent the deterioration of the light emitting efficiency of a light emitting diode package by forming a rough surface on the light emitting surface of the LED chip. CONSTITUTION: A package body(10) comprises a recess region(12) opened on the top. A lead electrode(30) is expanded to the outside through the side of the package body. An LED chip(20) is mounted on the recess region. A lens unit(40) is spaced form the LED chip and installed on the top of the package body. A heat sink emits the heat generated from the LED chip to the outside.
