发明名称 CAMERA MODULE AND DIGITAL IMAGE PROCESSING APPARATUS THEREWITH
摘要 PURPOSE: A camera module and digital image processing apparatus including the same are provided to implement a camera module in chip size level through a simple structure by improving the circuit connection structure of the image sensor. CONSTITUTION: Light is incident into a lens unit(110), and an image sensor(120) is coupled to the lens unit to receive the image inputted through the lens unit. A flexible substrate(130) contacts the both sides of the image sensor, and the image sensor includes a pixel region and a die pad of an image inputted passing through the lens unit. The die pad is arranged on one side of the image sensor.
申请公布号 KR20110039113(A) 申请公布日期 2011.04.15
申请号 KR20090096398 申请日期 2009.10.09
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 CHO, YANG SIK
分类号 H04N5/225 主分类号 H04N5/225
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