发明名称 MULTI-PIECE BOARD MANUFACTURING METHOD
摘要 <p>A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board.</p>
申请公布号 KR20110039365(A) 申请公布日期 2011.04.15
申请号 KR20117004835 申请日期 2009.10.29
申请人 IBIDEN CO., LTD. 发明人 HASEGAWA YASUSHI
分类号 H05K3/00;H05K1/02 主分类号 H05K3/00
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