| 摘要 |
<p>Provided are a component mounting device and a mounting state inspection method used therein that make it easy to perform accurate inspections of mounting states. In the provided method, inspection devices (M3A, M6A) perform substrate-imaging operations, in which an inspection region of a substrate is imaged and image data is acquired, before and after mounting. A component-extraction processing unit (3a) then extracts components by obtaining the difference between the acquired pre-mounting image data and post-mounting image data. A determination processing unit (3b) then determines whether components are properly mounted on the substrate by comparing the extracted shapes and positions of components with inspection data that represents pre-stored canonical component shapes and positions. This method eliminates the unstable elements in methods that identify and extract components on the basis of component and substrate color information.</p> |
