| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a novel method high in processing efficiency and stability and excellent in safety in a processing method by laser irradiation. <P>SOLUTION: A multi-layer structure (a printed wiring board including a base film and a metal layer, a conductive member forming laminated material including a base material layer and a catalyst ink layer or the like) having the base material layer 2 and a processing material layer 1, when the processing material layer 1 is processed by a method of irradiating it with a laser beam 5 through a condensing lens 6 or the like to form a desired pattern, a coolant such as water (ion exchange water 3) or the like is put on a stage 4 to cool it in contact with the base material layer side. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
