| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation circuit board, reducing concentration of electric fields at the ends of wiring patterns, suppressing partial discharge and having high reliability, in a high voltage insulation circuit board to be used in power devices such as power converters including, for example, power semiconductor devices, inverter modules and the like. SOLUTION: The insulation circuit board includes a metal base substrate and wiring patterns formed on at least one face of the metal base substrate with an insulating layer disposed therebetween. Between two adjacent wiring patterns having a potential difference among the wiring patterns, one or more wiring patterns or conductors are arranged, wherein the wiring patterns or conductors are brought into contact with the insulating layer and have a potential that is in between the potential difference between the two adjacent wiring patterns. The insulation circuit board reduces concentration of electric fields at the ends of the wiring patterns on which a high voltage is applied, thereby improving a partial discharge resistant characteristic. COPYRIGHT: (C)2011,JPO&INPIT |
