| 摘要 |
PROBLEM TO BE SOLVED: To precisely laminate a substrate and a support substrate supporting the substrate all over the substrate by reducing a pressure difference when pressing them. SOLUTION: A laminating device 1 for laminating a wafer W having a circular plane shape and the support substrate G supporting the wafer W includes a frame 10 to be engaged with an external side of the wafer W and the external side of the support substrate G in a sate where the wafer and the support substrate G are superimposed, and a roller 11 pressing the wafer and the support substrate G engaged with the frame 10 along with the frame 10. The roller 11 is formed with its axial length longer than a diameter of the wafer. COPYRIGHT: (C)2011,JPO&INPIT |
