| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board composition having a physical property of excellent high temperature resistance and stability of 600 sec or more in a solder oven at 288°C after subjected to the autoclave test for 0.5 hr, to provide a circuit board achieving peel strength of 10 lbf/inch or more even using an ordinary 1 oz copper foil, to provide a circuit board having a lower moisture absorption rate than a copper foil substrate generally used currently, and further to provide a circuit board of flame-resistant composition which reaches UL94 V-0 flame resisting standard even with a low bromine content. SOLUTION: The circuit board resin composition comprises (A) a halogen epoxy resin including a modified oxazolidone obtained by mixing a halogen epoxy resin with a catalyst of a quaternary ammonium salt and by reacting with an isocyanate, (B) an epoxy resin including two or more epoxy groups, (C) a curing agent, and (D) a curing accelerator. COPYRIGHT: (C)2011,JPO&INPIT |
