| 摘要 |
<p>Disclosed is a circuit board (1), which is provided with an insulating substrate (10), and an electric circuit pattern (20) formed on the insulating substrate (10). The electric circuit pattern (20) has a mounting pad section (30), and a wiring section (40) extending from the mounting pad section (30). The mounting pad section (30) has a first nonparallel surface (32a) that tilts with respect to the main surface (41) of the wiring section (40) or substantially orthogonally intersects the main surface.</p> |
