| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad capable of improving flatness accuracy in a polishing object, by securing cushion performance. <P>SOLUTION: This polishing pad 10 has a urethane sheet 2 having a polishing surface Sp and cross-linking and hardening the whole after forming a film by a wet solidification method. In the urethan sheet 2, a skin layer when forming the film is removed, and a large number of longitudinally long cells 3 are formed in the thickness direction inside. A large cell 3a having the size in the longitudinally long direction of 50% or more to a thickness (t) of the urethane sheet 2, has a maximum hole diameter A in a position separated from the polishing surface Sp by the length of exceeding 1/2 of the size in the longitudinally long direction. In the urethane sheet 2, an average value per unit area of the ratio A/B of the maximum hole diameter A to an average hole diameter B of an opening hole formed of the cells 3 in a cross section parallel to the polishing surface Sp on the inside by 5% of the thickness (t) from the polishing surface Sp, is adjusted in a range of 5-20. Hardness of the urethane sheet 2 is enhanced, and the large cell 3a is deformed by polishing pressure. <P>COPYRIGHT: (C)2011,JPO&INPIT |
