ADHESIVE RESIN COMPOSITION FOR SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition exhibiting an excellent adhesivity to silicon wafers after cured. SOLUTION: The adhesive resin composition for silicon wafers includes a compound having a urea structure in an amount that the urea structure portion of the compound accounts for 0.1-50 pts.mass to 100 pts.mass of an epoxy resin. COPYRIGHT: (C)2011,JPO&INPIT