发明名称 |
Self Aligned Air-Gap in Interconnect Structures |
摘要 |
An integrated circuit structure comprising an air gap and methods for forming the same are provided. The integrated circuit structure includes a conductive line; a self-aligned dielectric layer on a sidewall of the conductive line; an air-gap horizontally adjoining the self-aligned dielectric layer; a low-k dielectric layer horizontally adjoining the air-gap; and a dielectric layer on the air-gap and the low-k dielectric layer.
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申请公布号 |
US2011084357(A1) |
申请公布日期 |
2011.04.14 |
申请号 |
US20100972228 |
申请日期 |
2010.12.17 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIU CHUNG-SHI;YU CHEN-HUA |
分类号 |
H01L23/482 |
主分类号 |
H01L23/482 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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