发明名称 Self Aligned Air-Gap in Interconnect Structures
摘要 An integrated circuit structure comprising an air gap and methods for forming the same are provided. The integrated circuit structure includes a conductive line; a self-aligned dielectric layer on a sidewall of the conductive line; an air-gap horizontally adjoining the self-aligned dielectric layer; a low-k dielectric layer horizontally adjoining the air-gap; and a dielectric layer on the air-gap and the low-k dielectric layer.
申请公布号 US2011084357(A1) 申请公布日期 2011.04.14
申请号 US20100972228 申请日期 2010.12.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIU CHUNG-SHI;YU CHEN-HUA
分类号 H01L23/482 主分类号 H01L23/482
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