CHIP FUSE

摘要

Provided is a chip fuse wherein a fuse element composed of metal resinate reliably melts when excess current passes through. Surface electrodes (3) and an undercoating (13) are formed on the surface of a chip-shaped substrate (1), and a thick-film fuse element (17) composed of metal resinate is formed on the surface electrodes (3) and the undercoating (13). The thick-film fuse element is coated with an overcoating composed of an insulation resin material having a firing temperature lower than the firing temperature of the metal resinate.