<p>A manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus are provided. The manufacturing apparatus includes a housing that defines a chamber. The housing also defines an inlet for introducing a gas into the chamber and an outlet for exhausting the gas from the chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The electrode has an exterior surface. A first exterior coating having an electrical conductivity of at least 7x106 Siemens/meter at room temperature is disposed on the exterior surface of the electrode. A second exterior coating different from the first exterior coating is disposed on the first exterior coating. A power supply device is coupled to the electrode.</p>
申请公布号
WO2011044441(A1)
申请公布日期
2011.04.14
申请号
WO2010US51945
申请日期
2010.10.08
申请人
HEMLOCK SEMICONDUCTOR CORPORATION;HILLABRAND, DAVID;MCCOY, KEITH