发明名称 THERMOSETTING RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin molding material capable of obtaining a molded product excellent in electrical characteristics and flame retardance without using a phosphorus flame retardant. SOLUTION: This thermosetting resin molding material includes a resol type phenol resin (A), an epoxy resin (B) and a melamine resin (C). Preferably, based on the total amount of the molding material, the content of the resol type phenol resin (A) is 1-30 wt.%, that of the epoxy resin (B) is 10-60 wt.%, and that of the melamine resin (C) is 1-10 wt.%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011074173(A) 申请公布日期 2011.04.14
申请号 JP20090225975 申请日期 2009.09.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 TANAHASHI KOICHI
分类号 C08G59/62 主分类号 C08G59/62
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