| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition having superior heat dissipation properties and being capable of obtaining a cured material superior in heat resistant crack and workability. <P>SOLUTION: The photosensitive composition contains at least one component from among a polymerizable hydrocarbon monomer and a polymerizable hydrocarbon polymer, a first inorganic filler, a second inorganic filler and a photopolymerization initiator. Thermal conductivity of the first inorganic filler is 10 W/mK or more, and new Mohs hardness is 3.1 or more. The new Mohs hardness of the second inorganic filler is 3 or less. <P>COPYRIGHT: (C)2011,JPO&INPIT |
