发明名称 |
SEMICONDUCTOR DEVICE, POWER SEMICONDUCTOR MODULE, AND POWER CONVERTER EQUIPPED WITH POWER SEMICONDUCTOR MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an excellent productive semiconductor device, power semiconductor module, or power converter. <P>SOLUTION: The semiconductor device includes: a case having an opening part; a semiconductor element placed in the case; a first conductor plate which is placed in the case and is located on one surface side of the semiconductor element; a second conductor plate which is placed in the case and is located on the other surface side of the semiconductor element; a positive bus bar which is electrically connected to the first conductor plate and is for supplying direct current electric power; a negative bus bar which is electrically connected to the second conductor plate and is for supplying direct current electric power; a first resin material which is for closing up the opening part of the case; and a second resin material which is made of material different from the semiconductor element, the first conductor plate and the first resin material for sealing the second conductor plate. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011077464(A) |
申请公布日期 |
2011.04.14 |
申请号 |
JP20090230136 |
申请日期 |
2009.10.02 |
申请人 |
HITACHI AUTOMOTIVE SYSTEMS LTD |
发明人 |
TOKUYAMA TAKESHI;NAKATSU KINYA;SAITO RYUICHI;SATO TOSHIYA;ISHIKAWA HIDEAKI;TSUYUNO ENJO;AMAGI SHIGEO |
分类号 |
H01L25/07;H01L25/18;H02M7/48 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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