发明名称 SEMICONDUCTOR DEVICE, POWER SEMICONDUCTOR MODULE, AND POWER CONVERTER EQUIPPED WITH POWER SEMICONDUCTOR MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide an excellent productive semiconductor device, power semiconductor module, or power converter. <P>SOLUTION: The semiconductor device includes: a case having an opening part; a semiconductor element placed in the case; a first conductor plate which is placed in the case and is located on one surface side of the semiconductor element; a second conductor plate which is placed in the case and is located on the other surface side of the semiconductor element; a positive bus bar which is electrically connected to the first conductor plate and is for supplying direct current electric power; a negative bus bar which is electrically connected to the second conductor plate and is for supplying direct current electric power; a first resin material which is for closing up the opening part of the case; and a second resin material which is made of material different from the semiconductor element, the first conductor plate and the first resin material for sealing the second conductor plate. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011077464(A) 申请公布日期 2011.04.14
申请号 JP20090230136 申请日期 2009.10.02
申请人 HITACHI AUTOMOTIVE SYSTEMS LTD 发明人 TOKUYAMA TAKESHI;NAKATSU KINYA;SAITO RYUICHI;SATO TOSHIYA;ISHIKAWA HIDEAKI;TSUYUNO ENJO;AMAGI SHIGEO
分类号 H01L25/07;H01L25/18;H02M7/48 主分类号 H01L25/07
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