| 摘要 |
PROBLEM TO BE SOLVED: To suitably divide an adhesive film along a predetermined division line of a wafer even when the adhesive film is thicker than a certain thickness when dividing a workpiece on which the adhesive film is stuck. SOLUTION: The work 2 is divided along the predetermined division line L starting at reforming regions 5, 6 by: sticking an expansion tape T on a work 2, having the adhesive film 1 stuck on a reverse surface W2 of the workpiece W, on the side of the adhesive film 1; detecting the position of the predetermined division line L on a top surface W1 of the workpiece W; forming the reforming region 5 on a top surface 1a of the adhesive film 1 or in it by irradiating the workpiece W with a laser beam transmitted through the workpiece W from the side of the top surface W1 on the basis of information on the detected predetermined division line L in a state wherein the beam has its condensing point set on the top surface 1a or in the adhesive film 1; forming the reforming region 6 in the workpiece W by irradiating the workpiece W with a laser beam transmitted through the workpiece W from the side of the top surface W1 on the basis of the information on the detected predetermined division line L in a state wherein the beam has its condensing point set in the workpiece W; and expanding the expansion tape T. COPYRIGHT: (C)2011,JPO&INPIT |
