发明名称 THIN-FILM CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a thin-film capacitor capable of preventing the degradation of electrical characteristics caused by direct contact between the adhesion layer of a terminal electrode and a dielectric layer, thereby increasing reliability. SOLUTION: The thin-film capacitor 10 includes: a dielectric layer 12 deposited on a base electrode 11; an upper electrode layer 13 deposited on the dielectric layer 12; a terminal electrode 17 including an adhesion layer 17a, a seed layer 17b, and a plating layer 17c; a resin layer 14 for wiring provided between the upper electrode layer 13 and the terminal electrode 17 for isolating the upper electrode layer 13 from the terminal electrode 17; and a wiring layer 15 provided so as to extend through the resin layer 14 for wiring in contact with the adhesion layer 17a for electrically connecting the upper electrode layer 13 and the terminal electrode 17, wherein the composition of the wiring layer 15 differs from that of the adhesion layer 17a of the terminal electrode 17, and wherein reducing power of the wiring layer 15 to the dielectric layer 12 is smaller than that of the adhesion layer 17a. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011077343(A) 申请公布日期 2011.04.14
申请号 JP20090228092 申请日期 2009.09.30
申请人 TDK CORP 发明人 OIKAWA YASUNOBU;YANO YOSHIHIKO
分类号 H01G4/33;H01G4/12 主分类号 H01G4/33
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