发明名称 |
Chip type electric double layer capacitor and method for manufacturing the same |
摘要 |
The present invention provides a chip type electric double layer capacitor including: a lower case having an internal space of which an upper surface is opened and an external terminal of which portions exposed to a bottom of the internal space and the outside are connected to each other; an electric double layer capacitor cell disposed in the internal space of the lower case to be electrically connected to the portion of the external terminal, which is exposed to the bottom of the internal space; and an upper cap mounted on the lower case to cover the internal space, and a method for manufacturing the same.
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申请公布号 |
US2011085283(A1) |
申请公布日期 |
2011.04.14 |
申请号 |
US20090654448 |
申请日期 |
2009.12.18 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK DONG SUP;PARK ILL KYOO;JUNG CHANG RYUL;LEE SANG KYUN;CHO YEONG SU;LEE SUNG HO |
分类号 |
H01G9/155 |
主分类号 |
H01G9/155 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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