| 摘要 |
A semiconductor device includes a substrate having first and second major surfaces and conductive traces, and solder balls attached to the second major surface of the substrate. A semiconductor die including an integrated circuit (IC) is attached to one of the major surfaces of the substrate. The IC is electrically connected to the solder balls by the conductive traces. The substrate includes an integrally molded stand-off feature that prevents the solder balls near the corners and the sides of the substrate from being knocked off during handling. The stand-off feature also maintains a predetermined distance between the substrate and a printed circuit board (PCB) when the substrate is attached to the PCB, and then a reflow process is performed. The stand-off feature also prevents open connections between the solder balls and the PCB that may be caused by warping of the PCB or the weight of the semiconductor die. The semiconductor device may include a stiffener ring attached to the second major surface of the substrate and surrounding the conductive balls. |
