| 摘要 |
PURPOSE: A method and device for bonding a wire are provided to prevent oxide from being accumulated on a bonding wire and/or bond pad by supplying pure hydrogen process gas to a bonding area. CONSTITUTION: A device for bonding a wire includes a bond wire guide unit and a melting guide device. The melting guide device melts the limited part of the bond wire surface. The bond wire guide unit guides the limited part of the bond wire to a bonding area(1) and connects the limited part of the bond wire to one or more bond pads. The bonding area includes a process gas inlet(3). A process gas inlet is connected to an on-site gas generator(5) which generates process gas. |
